【專利讓與及授權】科技部計畫產出專利公告(2件)

項次

技術名稱

專利證書號

摘要

專利期

1

抑制錫-鎳介金屬於銲點中生成的方法

I381901

一種抑制錫-鎳介金屬於銲點中生成的方法如下所述。首先，提供一銲料，銲料的材質包括錫。接著，將銲料配置於一表面處理層上，其中表面處理層的材質包括鎳，且銲料與表面處理層至少其中之一的材質更包括鈀。然後，將銲料銲接至表面處理層以形成一銲點，其中銲點的材質包括鈀，以抑制錫-鎳介金屬於銲點中生成。

2013/01/11-2029/12/14

2

具多層介金屬層的銲點結構SOLDER JOINT WITH A MULTILAYER INTERMETALLIC COMPOUND STRUCTURE

US 9,079,272 B2

A solder joint with a multilayer IMC structure is provided. The solder joint includes a Cu pad, a Sn-based solder, a first, a second, and a third IMC layer. The Cu pad is disposed opposite to the Sn-based solder. The first IMC layer is disposed between the Cu pad and the Sn-based solder. The first IMC layer is a Cu.sub.3Sn layer. The second IMC layer is disposed between the first IMC layer and the Sn-based solder. The second IMC layer is a (Cu.sub.1-x1-y1Ni.sub.x1Pd.sub.y1).sub.6Sn.sub.5 layer, wherein x1 is in the range between 0 and 0.15, and y1 is in the range between 0 and 0.02. The third IMC layer is disposed between the second IMC layer and the Sn-based solder. The third IMC layer is a (Cu.sub.1-x2-y2Ni.sub.x2Pd.sub.y2).sub.6Sn.sub.5 layer, wherein x2 is in the range between 0 and 0.4, y2 is in the range between 0 and 0.02, and x2>x1.

2013/02/27-2033/05/28